SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY APPARATUS AND ELECTRONIC DEVICE

Title:

SUBSTRATE AND MANUFACTURING METHOD THEREFOR, DISPLAY APPARATUS AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/184149

Kind Code:

A1

Abstract:

A substrate and a manufacturing method therefor, a display apparatus and an electronic device, which belong to the technical field of semiconductors. The substrate comprises: a base (01); an insulation layer located on the base (01), wherein the surface on a side of the insulation layer that is away from the base (01) is provided with a groove (12), the groove (12) has a depth of greater than 2 um, the ratio of the depth to the width of the groove (12) is greater than 1, the width is the dimension of a longitudinal section of the groove (12) in a first direction, which is parallel to the base (01), the depth is the dimension of the longitudinal section of the groove (12) in a second direction, which is perpendicular to the base (01); and a metal trace (09) located in the groove (12), the thickness of the metal trace (09) being equal to or substantially equal to the depth of the groove (12). The transmittance of the substrate is improved.

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Inventors:

JIA MENGWEN (CN)
ZHOU JIAN (CN)
ZHANG YAFEI (CN)
QU FENG (CN)
LI BIQI (CN)

Application Number:

PCT/CN2022/083670

Publication Date:

October 05, 2023

Filing Date:

March 29, 2022

Export Citation:

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Assignee:

BOE TECHNOLOGY GROUP CO LTD (CN)
BEIJING BOE TECHNOLOGY DEV CO LTD (CN)

International Classes:

G01R31/26; G01N21/88; H05K3/18

Foreign References:

US20050099190A1	2005-05-12
US20060232768A1	2006-10-19
CN105451455A	2016-03-30
CN109768027A	2019-05-17
CN111982392A	2020-11-24
US20090098727A1	2009-04-16