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Title:
SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENTS, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2019/044706
Kind Code:
A1
Abstract:
A substrate for mounting electronic components has: an insulating substrate for mounting electronic components; a via conductor positioned in the thickness direction inside the insulating substrate; and a via pad conductor that is positioned inside the insulating substrate, is connected to the via conductor, has gradually increasing thickness from the outer edge part toward the inside, and includes protruding parts that protrude from the via conductor in the width direction of the via conductor.

Inventors:
FUKUZONO SHIGEYOSHI (JP)
BABA YUUKI (JP)
Application Number:
PCT/JP2018/031376
Publication Date:
March 07, 2019
Filing Date:
August 24, 2018
Export Citation:
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Assignee:
KYOCERA CORP (JP)
International Classes:
H01L33/62; H01L23/12; H05K3/46
Foreign References:
JP2003298240A2003-10-17
JP2005011883A2005-01-13
JP2014086679A2014-05-12
JP2015159245A2015-09-03
Other References:
See also references of EP 3678196A4
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