Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE FOR MOUNTING ELECTRONIC ELEMENT, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/042819
Kind Code:
A1
Abstract:
Provided are a substrate for mounting an electronic element and an electronic device which make it possible to improve impact resistance. A substrate 1 for mounting an electronic element according to one embodiment of the present invention comprises: a first wiring board 2 in a quadrangular frame shape an inside portion of the first wiring board serving as a first through hole 2a; a second wiring board 6 in a quadrangular frame shape or plate shape, the board being provided so as to be overlapped by the lower surface of the first wiring board 2, having one side of an outer edge of the second wiring board located further outward than one side corresponding to an outer edge of the first wiring board 2, and being electrically connected to the first wiring board 2; a metal plate 4 provided so as to be overlapped by the lower surface of the second wiring board 6 so as to sandwich the second wiring board 6 between itself and the first wiring board 2, and having an outer edge located further outward than the outer edge of the first wiring board 2 and located further inward than the one side of the outer edge of the second wiring board 6; and a lens holder 5, which is a cover body that is fixed to an outer peripheral portion of the metal plate 4 by sandwiching a portion of the one side of the outer edge of the second wiring board 6, so as to cover the first wiring board 2 and the second wiring board 6. The inside of the frame of the first wiring board 2, or the inside of the frame of the first wiring board 2 and the second wiring board 6, serves as an electronic element mounting space 11.

Inventors:
SAKAI MITSUHARU (JP)
YAMASAKI SHOU (JP)
INUYAMA SHIGETOSHI (JP)
NIINO NORITAKA (JP)
Application Number:
PCT/JP2015/059477
Publication Date:
March 24, 2016
Filing Date:
March 26, 2015
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L27/14; H01L23/02; H01L31/02; H01L33/62; H04N5/335; H05K3/46
Foreign References:
JP2011035458A2011-02-17
JP2006303484A2006-11-02
JP2004335533A2004-11-25
JPS61234159A1986-10-18
JPS59161187A1984-09-11
JP2011228591A2011-11-10
US20070029664A12007-02-08
US20090051018A12009-02-26
Other References:
See also references of EP 3196940A4
Download PDF: