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Title:
SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/068124
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing apparatus for processing a substrate such as a wafer, in particular to a substrate processing apparatus that presses a processing tool against a surface of the substrate while holding the peripheral edge of the substrate with a rotary roller, to process the surface of the substrate. This substrate processing apparatus comprises: a plurality of rollers (11A-11D) arranged around a reference center point (CP) and disposed in contact with the peripheral edge of a substrate W; a pressing member (21A) that presses a processing tool (3) against an outer peripheral portion of the surface of the substrate W; and an actuator (22A) that provides the pressing member (21A) with a pressing force. Two (11A, 11B) of the plurality of rollers (11A-11D) are disposed adjacent to the pressing member (21A) on both sides of the pressing member (21A).

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Inventors:
KOBAYASHI KENICHI (JP)
FUJISAWA MAO (JP)
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2022/037991
Publication Date:
April 27, 2023
Filing Date:
October 12, 2022
Export Citation:
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Assignee:
EBARA CORP (JP)
International Classes:
B24B21/08; B24B21/00; B24B41/06; H01L21/304; H01L21/677; H01L21/683
Foreign References:
JP2019077003A2019-05-23
JP2021122895A2021-08-30
US20100194011A12010-08-05
JPH10289892A1998-10-27
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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