Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/019104
Kind Code:
A1
Abstract:
A substrate processing device according to an embodiment of the present invention is provided with a conveyance mechanism (44) and a supply nozzle (60). The conveyance mechanism conveys, in a flat floating manner, a substrate (S) having a surface on which a photoresist film exposed to light is formed. The supply nozzle applies a developer to the substrate conveyed by the conveyance mechanism. The conveyance mechanism conveys the substrate to which the developer is applied by the supply nozzle, with the front part of the substrate being lowered.
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Inventors:
SADA TETSUYA (JP)
NAGATA HIROSHI (JP)
ASOU YUTAKA (JP)
NAGATA HIROSHI (JP)
ASOU YUTAKA (JP)
Application Number:
PCT/JP2021/025393
Publication Date:
January 27, 2022
Filing Date:
July 06, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/30; H01L21/027
Foreign References:
| US20190155161A1 | 2019-05-23 | |||
| JP2013229419A | 2013-11-07 | |||
| JP2005244022A | 2005-09-08 | |||
| JP2019216170A | 2019-12-19 | |||
| JPH08321536A | 1996-12-03 | |||
| JP2019220628A | 2019-12-26 | |||
| JP2019220517A | 2019-12-26 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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