SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2018/135138

A1

First and second supply liquid lines (412, 422) through which first and second supply liquids flow, respectively, are provided with first and second concentration measurement sections (415, 425). The second supply liquid has a dissolved gas concentration lower than a dissolved gas concentration in the first supply liquid. In the first and second supply liquid lines, one end of first and second branch lines (51, 52) is respectively connected at a position upstream of the concentration measurement section. The other end of the first and second branch lines is connected to a mixing section (57) in which the first and second supply liquids are mixed to produce a processing liquid. So that the processing liquid has a dissolved gas concentration of a set value, flow rate adjustment sections (58) of the first and second branch lines are controlled on the basis of measurement values from the first and second concentration measurement sections. In this way, the dissolved gas concentration in the processing liquid is accurately adjusted to the set value while supply liquid containing particles and the like due to the concentration measurement sections is prevented from being included in the processing liquid supplied to the substrate.

YASUDA SHUICHI (JP)
KOBAYASHI KENJI (JP)

PCT/JP2017/042645

July 26, 2018

November 28, 2017

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SCREEN HOLDINGS CO LTD (JP)

H01L21/306; H01L21/304

WO2015136872A1

2015-09-17

JP2004022572A	2004-01-22
JP2002205022A	2002-07-23
JP2003332322A	2003-11-21
JP2005175058A	2005-06-30
JP2002363775A	2002-12-18
JPH09232273A	1997-09-05

MATSUSAKA, Masahiro et al. (JP)

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