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Title:
SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/153118
Kind Code:
A1
Abstract:
This substrate processing device includes: a plurality of stages on which a plurality of substrates are respectively placed; and an annular member which is provided to each stage of the plurality of stages. The annular member is disposed at the outer circumference of the stage and at a position which is lower than the upper surface of the stage, and imparts a DC voltage using a DC power source.

Inventors:
KUBO ATSUSHI (JP)
MORISADA YOSHINORI (JP)
Application Number:
PCT/JP2020/000181
Publication Date:
July 30, 2020
Filing Date:
January 07, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; C23C16/52; H01L21/3065; H01L21/683
Foreign References:
US20070111339A12007-05-17
JP2018082100A2018-05-24
JP2016119472A2016-06-30
JPS6376435A1988-04-06
JP2007258417A2007-10-04
JPH06275543A1994-09-30
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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