SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD

WIPO Patent Application WO/2021/112022

A1

A substrate processing device (1) according to an embodiment of the present disclosure is provided with a control unit (61) which performs a first recipe and a second recipe in parallel which include a first transfer process for transferring a substrate from a passing unit (14) to a liquid process unit (17), a liquid process performed by the liquid process unit (17), a second transfer process for transferring the substrate from the liquid process unit (17) to a drying process unit (18), and a drying process performed by the drying process unit (18), the two recipes having mutually different processing times for at least the liquid process and the drying process. The control unit (61), when starting the second recipe with respect to a second substrate among a plurality of substrates while the first recipe is being performed with respect to a first substrate among the plurality of substrates, determines the start timing of the first transfer process with respect to the second substrate so that the period of the second transfer process with respect to the first substrate does not overlap the period of the second transfer process with respect to the second substrate.

GOTO SHUHEI (JP)
KANEKO TOMOHIRO (JP)
MATSUMOTO TAKESHI (JP)

PCT/JP2020/044378

June 10, 2021

November 27, 2020

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TOKYO ELECTRON LTD (JP)

H01L21/304; H01L21/677

JP2013012538A	2013-01-17
JP2014033180A	2014-02-20
JP2014022546A	2014-02-03
JP2006190894A	2006-07-20
US20070003842A1	2007-01-04

SAKAI INTERNATIONAL PATENT OFFICE (JP)

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