Title:
SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2018/150536
Kind Code:
A1
Abstract:
[Problem] To improve the overall productivity of a processing device in which a single wafer processing device and a vertical processing device can perform continuous processing. [Solution] A substrate processing device is provided with: a vertical processing furnace for processing N (5 ≤ N ≤ 50) substrates held by a substrate holder; a conveying chamber disposed below the vertical processing furnace and conveying the substrate holder to the vertical processing furnace; a plurality of single wafer processing furnaces being adjacent to the conveying chamber, processing M (1 ≤ M < 10) substrates at a time, and disposed stacked in at least two stages or more; and a transfer chamber being adjacent to the conveying chamber and the single wafer processing furnaces and installed with a transfer machine for transferring the substrates.
Inventors:
TAKANO SATOSHI (JP)
Application Number:
PCT/JP2017/005887
Publication Date:
August 23, 2018
Filing Date:
February 17, 2017
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/31; C23C16/44; H01L21/316; H01L21/677
Foreign References:
| JP2014524657A | 2014-09-22 | |||
| JP2000114187A | 2000-04-21 | |||
| JPH08321470A | 1996-12-03 | |||
| JPH07335602A | 1995-12-22 | |||
| JPH05144735A | 1993-06-11 |
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