Title:
SUBSTRATE PROCESSING DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2019/053805
Kind Code:
A1
Abstract:
The present invention makes it possible to provide a technology including a processing chamber for processing a substrate, a first microwave supply unit for supplying microwaves of a first frequency for heating a dielectric disposed in the processing chamber, and a second microwave supply unit for supplying microwaves of a second frequency higher than the first frequency and modifying the substrate surface. The technology also includes a control unit configured to control the first microwave supply unit and the second microwave supply unit so as to operate the first microwave supply unit until the substrate reaches a prescribed temperature, and once the substrate reaches the prescribed temperature, operate the second microwave supply unit.
Inventors:
TOYODA KAZUYUKI (JP)
YAMAMOTO TETSUO (JP)
YAMAMOTO TETSUO (JP)
Application Number:
PCT/JP2017/033043
Publication Date:
March 21, 2019
Filing Date:
September 13, 2017
Export Citation:
Assignee:
KOKUSAI ELECTRIC CORP (JP)
International Classes:
H01L21/268; H01L21/20
Domestic Patent References:
| WO2017145261A1 | 2017-08-31 |
Foreign References:
| JP2014090058A | 2014-05-15 | |||
| JP2011077065A | 2011-04-14 | |||
| JP2015173230A | 2015-10-01 | |||
| JP2014056927A | 2014-03-27 | |||
| JP2014053380A | 2014-03-20 | |||
| JPH01216522A | 1989-08-30 |
Download PDF: