Title:
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING SYSTEM, AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/190924
Kind Code:
A1
Abstract:
This substrate processing device processes a substrate by radiating the substrate with a laser beam, and comprises: a substrate holding part that holds the substrate; a laser irradiation lens that radiates the laser beam onto the substrate held by the substrate holding part; a laser oscillator that emits a laser beam further upward than a substrate holding surface of the substrate holding part; a mirror which, above the substrate holding part, changes the direction of the laser beam, emitted from the laser oscillator, to the horizontal direction; and an optical system that regulates the output of a laser beam that enters from the mirror, and guides said laser beam to the laser irradiation lens.
More Like This:
| JP6608732 | Wafer processing method |
| JP7176058 | Substrate processing method |
| JP2016074157 | RESIN JOINING METHOD BY LASER |
Inventors:
KAWAGUCHI YOSHIHIRO (JP)
YAMASHITA YOHEI (JP)
YAMASHITA YOHEI (JP)
Application Number:
PCT/JP2022/008206
Publication Date:
September 15, 2022
Filing Date:
February 28, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B23K26/57; B23K26/00; B23K26/064; H01L21/304; H01L21/677
Domestic Patent References:
| WO2020213479A1 | 2020-10-22 |
Foreign References:
| JP2019188455A | 2019-10-31 | |||
| JPH0335511Y2 | 1991-07-26 | |||
| JP2010501354A | 2010-01-21 | |||
| JP2017042805A | 2017-03-02 | |||
| JP2011230179A | 2011-11-17 | |||
| JP2011187481A | 2011-09-22 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Download PDF: