Title:
SUBSTRATE PROCESSING EQUIPMENT AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2006/006377
Kind Code:
A1
Abstract:
The sizes required for maintenance are reduced and an occupying floor area is reduced. In substrate processing equipment, a load lock chamber (41) and a transfer chamber (24) are arranged in this order in a case (11) from a rear side. The equipment is provided with a processing chamber (53) for processing a wafer (1) arranged on an upper part of the load lock chamber (41). On an area on the rear side of the transfer chamber (24) where the load lock chamber (41) is not arranged, an opening part (66) and an opening/closing means (67) for opening/closing the opening part (66) are arranged.
Inventors:
TAKESHITA MITSUNORI (JP)
MATSUDA TOMOYUKI (JP)
HIRANO MITSUHIRO (JP)
SATO AKIHIRO (JP)
MORITA SHINYA (JP)
MIYATA TOSHIMITSU (JP)
SHIBATA KOJI (JP)
MATSUDA TOMOYUKI (JP)
HIRANO MITSUHIRO (JP)
SATO AKIHIRO (JP)
MORITA SHINYA (JP)
MIYATA TOSHIMITSU (JP)
SHIBATA KOJI (JP)
Application Number:
PCT/JP2005/011714
Publication Date:
January 19, 2006
Filing Date:
June 27, 2005
Export Citation:
Assignee:
HITACHI INT ELECTRIC INC (JP)
TAKESHITA MITSUNORI (JP)
MATSUDA TOMOYUKI (JP)
HIRANO MITSUHIRO (JP)
SATO AKIHIRO (JP)
MORITA SHINYA (JP)
MIYATA TOSHIMITSU (JP)
SHIBATA KOJI (JP)
TAKESHITA MITSUNORI (JP)
MATSUDA TOMOYUKI (JP)
HIRANO MITSUHIRO (JP)
SATO AKIHIRO (JP)
MORITA SHINYA (JP)
MIYATA TOSHIMITSU (JP)
SHIBATA KOJI (JP)
International Classes:
H01L21/68; C23C16/44; H01L21/22; H01L21/285; H01L21/31; (IPC1-7): H01L21/68; C23C16/44; H01L21/22; H01L21/285; H01L21/31
Foreign References:
| JPH10242232A | 1998-09-11 | |||
| JPH07130721A | 1995-05-19 | |||
| JPH07297257A | 1995-11-10 | |||
| JP2003092329A | 2003-03-28 | |||
| JP2003007800A | 2003-01-10 |
Attorney, Agent or Firm:
Kajiwara, Tatuya (Central Nishi-Shinjuku 9-5, Nishi-Shinjuku 8-chom, Shinjuku-ku Tokyo 23, JP)
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