Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/241033
Kind Code:
A1
Abstract:
A substrate W, a central part of which is supported by a spin chuck 5, is rotated about a rotation axis A1. In an outer peripheral part etching step, an etching liquid is ejected from an ejection port 6a of a treatment liquid nozzle 6 toward a liquid application position 105 that is provided in an upper surface peripheral part 102 of the rotating substrate W. In the outer peripheral part etching step, the height of the upper surface peripheral part 102 (the height distortion HD of the upper surface peripheral part 102) is monitored, and the liquid application position 105 is moved in the radial direction RD on the basis of the thus-obtained height distortion HD of the upper surface peripheral part 102 (height distortion monitoring step (S6) and liquid application position moving step (S7)). Consequently, the inner peripheral position LFa of a liquid film LF that is formed of the etching liquid supplied to the liquid application position 105 is adjusted to come closer to a predetermined position.
Inventors:
ISHII HIROAKI (JP)
TAKAOKA MAKOTO (JP)
TAKAOKA MAKOTO (JP)
Application Number:
PCT/JP2020/014597
Publication Date:
December 03, 2020
Filing Date:
March 30, 2020
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Foreign References:
| JP2018046105A | 2018-03-22 | |||
| JP2017183512A | 2017-10-05 | |||
| JP2018142678A | 2018-09-13 | |||
| JP2018121045A | 2018-08-02 | |||
| JPH08139084A | 1996-05-31 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
Download PDF: