Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/230612
Kind Code:
A1
Abstract:
This substrate processing method includes: an SPM step of supplying an SPM to a surface of a substrate which is held in a horizontal position by a substrate holding unit with the surface of the substrate facing upward; an SPM reducing step, which is performed following completion of the SPM step, of removing the SPM from the surface of the substrate by rotating the substrate about an axis of rotation passing through the center of the substrate without supplying the SPM to the surface of the substrate, thereby reducing the amount of the SPM on the surface of the substrate to the extent that the surface of the substrate is not dried; and a rinsing step, which is performed after the SPM reducing step, of supplying a rinsing solution containing water to the surface of the substrate
Inventors:
ENDO TORU (JP)
HAYASHI MASAYUKI (JP)
HAYASHI MASAYUKI (JP)
Application Number:
PCT/JP2019/020769
Publication Date:
December 05, 2019
Filing Date:
May 24, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/027
Foreign References:
| JP2014011174A | 2014-01-20 | |||
| JP2015050351A | 2015-03-16 | |||
| JP2018056293A | 2018-04-05 | |||
| JP2018032728A | 2018-03-01 |
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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