Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/090052
Kind Code:
A1
Abstract:
The present invention pertains to a substrate processing device for processing substrates such as a wafer, and particularly to a substrate processing method and a substrate processing device which polish a bevel section of a substrate and perform a CMP process on a flat surface section of the substrate. The substrate processing method involves: polishing, with a polishing tool, bevel sections (B) of a plurality of substrates (W) so that the tilt angles (α) of tilt surfaces (S) of bevel sections (B) of the plurality of substrates (W) are equal to each other; and performing a CMP process on planar sections (P) of the plurality of substrates (W) in which the bevel sections (B) have been polished.
Inventors:
NAKANISHI MASAYUKI (JP)
Application Number:
PCT/JP2022/039327
Publication Date:
May 25, 2023
Filing Date:
October 21, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B37/10; B24B9/00; B24B21/00; B24B49/02; H01L21/304
Foreign References:
| JP2014167996A | 2014-09-11 | |||
| JP4916890B2 | 2012-04-18 | |||
| JP2009262249A | 2009-11-12 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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