Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/119847
Kind Code:
A1
Abstract:
The present invention relates to a substrate processing method and a substrate processing device for processing a substrate such as a wafer. In this substrate processing method, a substrate (W) having a notch (Nw) is rotated and moved in a circular motion by bringing rollers (11a, 11b), which are fixed to eccentric shafts (13a, 13b) including a reference shaft (13a) and a movable shaft (13b), into contact with a peripheral edge of the substrate (W) and moving the rollers (11a, 11b) in a circular motion, and a processing tool (201) is brought into contact with the substrate (W) to process the substrate (W). During the processing of the substrate (W), a rotation speed of the substrate (W) is calculated on the basis of a measured value of a notch detection sensor (77) for detecting passage of the notch (Nw) through the movable shaft (13b), and, if the rotation speed of the substrate (W) deviates from an allowable range set for a theoretical rotation speed of the substrate (W), an alert is given.
Inventors:
KASHIWAGI MAKOTO (JP)
Application Number:
PCT/JP2022/039674
Publication Date:
June 29, 2023
Filing Date:
October 25, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
B24B7/04; B24B41/06; B24B49/10; H01L21/304
Foreign References:
| JP2021002639A | 2021-01-07 | |||
| JP6491903B2 | 2019-03-27 |
Attorney, Agent or Firm:
HIROSAWA, Tetsuya et al. (JP)
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