Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/234368
Kind Code:
A1
Abstract:
A substrate processing method according to the present invention comprises: a preparation step for preparing a substrate that has, on a surface thereof, a first surface which contains Si and a second surface which has a different chemical composition from the first surface and which contains Si; a surface modification step for, after performing a silylation treatment in which a silylating agent is brought in contact with the first surface and the second surface, performing a water repellency adjustment treatment in which the water repellency of the second surface is selectively decreased, with respect to the first surface; and a processing step for selectively performing processing with respect to the second surface after the surface modification step.
Inventors:
TANIGUCHI TAKAHISA (JP)
LIN CHIH-CHIEN (JP)
MIYAZAKI TATSUO (JP)
OKUMURA YUZO (JP)
TERUI YOSHIHARU (JP)
LIN CHIH-CHIEN (JP)
MIYAZAKI TATSUO (JP)
OKUMURA YUZO (JP)
TERUI YOSHIHARU (JP)
Application Number:
PCT/JP2023/020344
Publication Date:
December 07, 2023
Filing Date:
May 31, 2023
Export Citation:
Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
H01L21/312; H01L21/316
Domestic Patent References:
| WO2022085449A1 | 2022-04-28 |
Foreign References:
| JP2001345302A | 2001-12-14 | |||
| JP2015515122A | 2015-05-21 | |||
| JP2013207220A | 2013-10-07 | |||
| JP2012222330A | 2012-11-12 | |||
| JP2012164949A | 2012-08-30 | |||
| JP2013128096A | 2013-06-27 | |||
| JPH0521433A | 1993-01-29 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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