Title:
SUBSTRATE PROCESSING METHOD, STORAGE MEDIUM, AND SUBSTRATE PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/238737
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a substrate processing method that effectively suppresses defects in a resist pattern. A substrate processing method according to the present invention involves forming a relief pattern from a resist on a substrate, including by development (S03), supplying a water-soluble material liquid to the recesses of the relief pattern and thereby reinforcing the protrusions (S04), curing the protrusions (S05), and removing a portion of the relief pattern that includes the portions reinforced by the reinforcing (S06).
Inventors:
SHIMOAOKI TAKESHI (JP)
DAUENDORFFER ARNAUD ALAIN JEAN (JP)
DAUENDORFFER ARNAUD ALAIN JEAN (JP)
Application Number:
PCT/JP2023/020108
Publication Date:
December 14, 2023
Filing Date:
May 30, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
G03F7/20; G03F7/40; H01L21/027
Domestic Patent References:
| WO2009008265A1 | 2009-01-15 | |||
| WO2004111734A1 | 2004-12-23 | |||
| WO2015129405A1 | 2015-09-03 | |||
| WO2015080061A1 | 2015-06-04 |
Foreign References:
| JP2017165846A | 2017-09-21 | |||
| JP2015023172A | 2015-02-02 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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