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Title:
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/095669
Kind Code:
A1
Abstract:
Provided is a substrate processing method for processing a substrate, comprising grinding a first surface of the substrate, and, after the first surface has been ground, grinding a second surface of the substrate opposite the first surface. During the grinding of the first surface, a first grinding mark is formed that curves and extends from a central portion of the first surface toward an outer periphery. During the grinding of the second surface, a second grinding mark is formed curving and extending from a central portion of the second surface toward the outer periphery. The curving direction of the first grinding mark and the curving direction of the second grinding mark are opposite from each other in a transparent view from one surface.

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Inventors:
HAYAKAWA SUSUMU (JP)
IKEUE KAZUYA (JP)
KANEKO TOMOHIRO (JP)
Application Number:
PCT/JP2022/042339
Publication Date:
June 01, 2023
Filing Date:
November 15, 2022
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; H01L21/306; H01L21/677
Domestic Patent References:
WO2019013037A12019-01-17
WO2001022484A12001-03-29
Foreign References:
JP2005205543A2005-08-04
JP2000150431A2000-05-30
JP2000288881A2000-10-17
JP2020205358A2020-12-24
JP2008047697A2008-02-28
CN112008595A2020-12-01
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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