Title:
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/113795
Kind Code:
A1
Abstract:
This substrate processing system for processing a bonded substrate obtained by bonding a first substrate and a second substrate is provided with: a processing device that grinds the first substrate; a first thickness measurement device that measures the thickness of the first substrate prior to grinding in the processing device and the total thickness of the bonded substrate including the first substrate; and a second thickness measurement device that measures the thickness of the first substrate after grinding in the processing device.
Inventors:
TAMURA TAKESHI (JP)
KODAMA MUNEHISA (JP)
KANEKO TOMOHIRO (JP)
KODAMA MUNEHISA (JP)
KANEKO TOMOHIRO (JP)
Application Number:
PCT/JP2021/041879
Publication Date:
June 02, 2022
Filing Date:
November 15, 2021
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B41/06; B24B7/04; B24B49/02; B24B55/06; H01L21/304; H01L21/66; H01L21/683
Domestic Patent References:
| WO2018235619A1 | 2018-12-27 |
Foreign References:
| JP2012033585A | 2012-02-16 | |||
| JP2009274139A | 2009-11-26 | |||
| JP2014226749A | 2014-12-08 | |||
| JP2017113811A | 2017-06-29 | |||
| JP2017056523A | 2017-03-23 | |||
| JP2021084146A | 2021-06-03 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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