Title:
SUBSTRATE PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2020/039803
Kind Code:
A1
Abstract:
This substrate processing system is equipped with a processing device for processing a substrate and a first transport device for transporting the substrate into and from the processing device, wherein the processing device is equipped with a rotating table and four chuck tables, a first transfer position, a second transfer position, a first processing position and a second processing position are provided around the center axis of rotation of the rotating table, the first and second transfer positions are positions where the transfer of the substrate to and from the chuck tables occurs, and the first and second processing positions are positions where a grinding tool or polishing tool processes the substrate held by the chuck tables.
Inventors:
KODAMA MUNEHISA (JP)
Application Number:
PCT/JP2019/028109
Publication Date:
February 27, 2020
Filing Date:
July 17, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B24B7/00; B24B41/06; H01L21/304
Foreign References:
| JPS61297072A | 1986-12-27 | |||
| JP2016051872A | 2016-04-11 | |||
| JP2011165994A | 2011-08-25 | |||
| JP2012076171A | 2012-04-19 | |||
| JP2002050597A | 2002-02-15 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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