SUBSTRATE SOLUTION TREATMENT DEVICE AND SUBSTRATE SOLUTION TREATMENT METHOD

WIPO Patent Application WO/2021/230103

A1

Provided is a technique which is favorable for suppressing the mixing of particles into a treatment solution to be applied to a substrate. This substrate solution treatment device is equipped with: a supply tank into which a treatment solution is supplied via a guide line; a pressurizing device for pressurizing the inside of the supply tank; a discharge nozzle for discharging the treatment solution to be supplied; a supply line which is connected to the supply tank and discharge nozzle, and is not provided with an adjustment mechanism for variably limiting the channel connecting the supply tank and discharge nozzle; a first waste fluid line connected to a first branching section of the supply line between the supply tank and the discharge nozzle; a flow adjustment mechanism which limits the passage of the treatment solution, the pressure of which is lower than a set pressure, and is provided to the first waste fluid line; and a control unit for adjusting the set pressure.

NAKASHIMA MIKIO (JP)
KOMIYA HIROSHI (JP)
NAKAMORI MITSUNORI (JP)
KITANO JUNICHI (JP)
MINAMI TERUOMI (JP)
OTSUKA TAKAHISA (JP)
KOSAI KAZUKI (JP)
OJIMA TOMOAKI (JP)

PCT/JP2021/017152

November 18, 2021

April 30, 2021

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TOKYO ELECTRON LTD (JP)

B05C11/10; H01L21/304

JP2018137367A	2018-08-30
JP2016105505A	2016-06-09
JP2013059735A	2013-04-04

NAKAMURA Yukitaka et al. (JP)

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