THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF

Title:

THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF

Document Type and Number:

WIPO Patent Application WO/2021/230104

Kind Code:

A1

Abstract:

Provided is a thermosetting resin composition which produces a cured product exhibiting excellent low dielectric properties, high heat resistance and high adhesion properties.　The thermosetting resin composition contains an aromatic polyvalent hydroxy compound represented by general formula (1), and a maleimide compound. R1 each independently represent a C1-8 hydrocarbon group, R2 each independently represent a hydrogen atom or a dicyclopentenyl group, and at least one thereof is a dicyclopentenyl group. n represents the number of repeating units and the average value thereof is a number which is 1-5.

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Inventors:

SOH MASAHIRO (JP)
ISHIHARA KAZUO (JP)
TAKASHIMA TOMOYUKI (JP)
JEE JOONG HWI (KR)
PARK CHAN HO (KR)

Application Number:

PCT/JP2021/017169

Publication Date:

November 18, 2021

Filing Date:

April 30, 2021

Export Citation:

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Assignee:

NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
KUKDO CHEMICAL CO LTD (KR)

International Classes:

B32B27/28; B32B15/08; C08G65/40; C08J5/24; C08K5/13; C08K5/3415; C08L63/00; H01L23/29; H01L23/31

Domestic Patent References:

WO2020129724A1

2020-06-25

Foreign References:

JP2009102456A	2009-05-14
JP2009096819A	2009-05-07
JPS6399224A	1988-04-30
JPH055022A	1993-01-14
JP2014148653A	2014-08-21
JP2015067618A	2015-04-13

Attorney, Agent or Firm:

SASAKI Kazuya et al. (JP)

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