Title:
SUBSTRATE, SUBSTRATE STRUCTURE, AND MANUFACTURING PROCESS
Document Type and Number:
WIPO Patent Application WO/2019/113814
Kind Code:
A1
Abstract:
A substrate is provided. A plurality of concave structures are arranged on the substrate. An upper plane surface is located between two adjacent concave structures. The concave structure sequentially comprises, from top to bottom, a transition surface, a sidewall, and a lower surface. The sidewall extends upwards along an edge of the lower surface, and the sidewall and the lower surface together form a depression. The transition surface extends obliquely upwards along an end of the sidewall. One end of the transition surface is connected to the sidewall, and the other end is connected to the upper plane surface. A substrate manufacturing process is used to manufacture the above substrate and comprises the following steps: step S1: depositing of a mask layer and spin-coating a colloid on a substrate; step S2: etching the colloid with oxygen plasma; step S3: etching the mask layer; step S4: etching the substrate; and step S6: removing the mask layer.
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Inventors:
ZHANG LISHENG (CN)
HE ZONGJIANG (CN)
JIA ZHIQIANG (CN)
HE ZONGJIANG (CN)
JIA ZHIQIANG (CN)
Application Number:
PCT/CN2017/115804
Publication Date:
June 20, 2019
Filing Date:
December 13, 2017
Export Citation:
Assignee:
SHENZHEN QIANHAI XIAOYOU TECH CO LTD (CN)
SHENZHEN UVEI SILICON CO LTD (CN)
SHENZHEN UVEI SILICON CO LTD (CN)
International Classes:
H01L33/20; H01L33/22
Foreign References:
| CN103165771A | 2013-06-19 | |||
| KR20140046551A | 2014-04-21 | |||
| CN102576663A | 2012-07-11 | |||
| CN104112803A | 2014-10-22 |
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