SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

WIPO Patent Application WO/2019/044334

A1

This substrate treatment method comprises: a substrate rotating step of rotating a horizontally held substrate around a rotation axis line extending in a vertical direction; a facing member positioning step of positioning a facing member which faces the substrate from above and comprises an extending section having an inner peripheral surface enclosing the substrate in plan view, said facing member being positioned at a position at which the inner peripheral surface of the extending section faces the substrate outwardly in a radial direction centered on the rotation axis line; a facing member rotating step of rotating the facing member around the rotation axis line; a treatment solution supply step of supplying a treatment solution to the upper surface of the substrate in the rotating state; and a guard positioning step of positioning a guard which encloses the substrate radially outward of the extending section in plan view, said guard being positioned at a height position for receiving the treatment solution scattering from the upper surface of the substrate and outward in the radial direction according to the affinity of the treatment solution for the inner peripheral surface of the extending section.

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OSAWA MIZUKI (JP)
EBISUI HIROSHI (JP)

PCT/JP2018/028678

March 07, 2019

July 31, 2018

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SCREEN HOLDINGS CO LTD (JP)

H01L21/304

JP2017005195A	2017-01-05
JP2016225427A	2016-12-28
JP2014049606A	2014-03-17
JP2017034235A	2017-02-09

AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)

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