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Title:
SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/196077
Kind Code:
A1
Abstract:
This substrate treatment method comprises: a substrate preparation step for preparing a substrate having a main surface on which a first oxide layer is exposed; a first etching step for forming a first polymer film, which contains a first acid polymer, on the main surface of the substrate and etching the substrate; and a first rinsing step for, after the first etching step, supplying a first rinse liquid for rinsing the main surface of the substrate onto the main surface of the substrate.

Inventors:
TAHARA KANA (JP)
YOSHIDA YUKIFUMI (JP)
Application Number:
PCT/JP2022/001503
Publication Date:
September 22, 2022
Filing Date:
January 18, 2022
Export Citation:
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Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/304; H01L21/306
Domestic Patent References:
WO2017086112A12017-05-26
Foreign References:
US20120196444A12012-08-02
JP2011511442A2011-04-07
US20100035436A12010-02-11
JP2015522951A2015-08-06
Attorney, Agent or Firm:
AI ASSOCIATION OF PATENT AND TRADEMARK ATTORNEYS (JP)
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