Title:
SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2023/113130
Kind Code:
A1
Abstract:
The present invention relates to a substrate treatment method and, more specifically, to a substrate treatment method for improving substrate properties. The present invention provides a substrate treatment method comprising: a first compression and decompression step (S100) for performing, at least once, compression and decompression of a chamber in which a substrate is treated; and a second compression and decompression step (S200) for performing, at least once, compression and decompression of the chamber at a temperature higher than the first compression and decompression step (S100), after the first compression and decompression step (S100).
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Inventors:
KIM CHANG HUN (KR)
JANG WON JUN (KR)
KIM JOO SUOP (KR)
PARK KYUNG (KR)
NAM SANG ROK (KR)
AHN WON SIK (KR)
AHN HAE JIN (KR)
LEE DAE SEONG (KR)
JANG WON JUN (KR)
KIM JOO SUOP (KR)
PARK KYUNG (KR)
NAM SANG ROK (KR)
AHN WON SIK (KR)
AHN HAE JIN (KR)
LEE DAE SEONG (KR)
Application Number:
PCT/KR2022/010529
Publication Date:
June 22, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
WONIK IPS CO LTD (KR)
International Classes:
H01L21/02; C23C16/56
Foreign References:
| KR20200006422A | 2020-01-20 | |||
| KR100332129B1 | 2002-11-07 | |||
| KR20100057101A | 2010-05-28 | |||
| KR20210045296A | 2021-04-26 | |||
| US20170233866A1 | 2017-08-17 |
Attorney, Agent or Firm:
B&IP-JOOWON PATENT AND LAW FIRM (KR)
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