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Title:
SUBSTRATE TREATMENT SYSTEM AND SUBSTRATE TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2020/017599
Kind Code:
A1
Abstract:
A substrate treatment system for treating a substrate, wherein the system has: a first reforming device for forming, on a superimposed substrate in which the surface of a first substrate and the surface of a second substrate are joined, an interior-surface-reforming layer that extends from a center part toward at least a peripheral edge part to be excluded of the first substrate, the layer extending in the planar direction on the interior of the first substrate; a second reforming device for forming a peripheral-edge-reforming layer that extends in the thickness direction along the boundary between the peripheral edge part and the center part on the interior of the first substrate; and a separation device for separating the reverse-surface side of the first substrate starting from the interior-surface-reforming layer.

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Inventors:
TANOUE HAYATO (JP)
UNO TAKASHI (JP)
OOKAWA SATOSHI (JP)
ENOKIDA SUGURU (JP)
Application Number:
PCT/JP2019/028310
Publication Date:
January 23, 2020
Filing Date:
July 18, 2019
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/304; B23K26/53; H01L21/683
Foreign References:
JP2006108532A2006-04-20
JP2017024039A2017-02-02
JP2015516672A2015-06-11
JP2018043340A2018-03-22
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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