Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
SUBSTRATE WITH BUILT-IN FUNCTIONAL ELEMENT
Document Type and Number:
WIPO Patent Application WO/2011/125354
Kind Code:
A1
Abstract:
Provided is a substrate with a built-in functional element, which has the functional element on a metal plate, wherein crosstalk-noise among signal wirings can be reduced, and characteristic impedance can be matched furthermore. The substrate with a built-in functional element comprises: a metal plate that has a recess section, and that is to become the ground; a functional element that is arranged at the recess section, and has electrode terminals; a first insulation layer that covers the functional element, and that is arranged to be in contact with the metal plate; a first wiring layer comprising first signal wirings that are arranged in opposition to the metal plate with the first insulation layer interposed therebetween; a second insulation layer that covers the first wiring layer; and a ground layer comprised of a ground plane that is arranged in opposition to the first wiring layer with the second insulation layer interposed therebetween.

Inventors:
OHSHIMA DAISUKE (JP)
MORI KENTARO (JP)
NAKASHIMA YOSHIKI (JP)
KIKUCHI KATSUMI (JP)
YAMAMICHI SHINTARO (JP)
Application Number:
PCT/JP2011/050874
Publication Date:
October 13, 2011
Filing Date:
January 19, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NEC CORP (JP)
OHSHIMA DAISUKE (JP)
MORI KENTARO (JP)
NAKASHIMA YOSHIKI (JP)
KIKUCHI KATSUMI (JP)
YAMAMICHI SHINTARO (JP)
International Classes:
H01L23/12; H05K3/46
Domestic Patent References:
WO2008056499A12008-05-15
Foreign References:
JP2001144245A2001-05-25
JP2007115772A2007-05-10
JPH06302960A1994-10-28
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Download PDF:
Claims: