Title:
SUBSTRATE WITH INTEGRATED COMPONENT
Document Type and Number:
WIPO Patent Application WO/2012/124673
Kind Code:
A1
Abstract:
Provided are: a production method for a substrate with an integrated component, said method being capable of preventing the misalignment of electronic components that are integrated into a substrate body; and a substrate with an integrated component. The method has: a first step for preparing a first resin sheet (11a), second resin sheets (11b, 11c) in which a first through hole (11s) and second through holes (11q) are formed spaced apart, and a third resin sheet (11d); a second step in which the second resin sheets (11b, 11c) are stacked upon the first resin sheet (11a) and compression bonded while being heated, with an electronic component (2) housed in the first through hole (11s); and (iii) a third step in which the third resin sheet (11d) is stacked upon the second resin sheet (11c) so as to cover the electronic component (2) and compression bonded while being heated. In at least the second or the third step, the second resin sheets (11b, 11c) are fluidized while being heated and fill the spaces formed by the second through holes (11q).
Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2012/056359
Publication Date:
September 20, 2012
Filing Date:
March 13, 2012
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
OTSUBO YOSHIHITO (JP)
OTSUBO YOSHIHITO (JP)
International Classes:
H05K3/46
Foreign References:
| JP2006073763A | 2006-03-16 | |||
| JP2003078250A | 2003-03-14 | |||
| JP2008141007A | 2008-06-19 | |||
| JP2004319701A | 2004-11-11 | |||
| JPH07307575A | 1995-11-21 |
Attorney, Agent or Firm:
YAMAMOTO TOSHINORI (JP)
Toshinori Yamamoto (JP)
Toshinori Yamamoto (JP)
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Claims: