Title:
SUBSTRATE WITH SILICA FILM
Document Type and Number:
WIPO Patent Application WO/2022/059353
Kind Code:
A1
Abstract:
A substrate with a silica film according to the present invention comprises a substrate comprising a glass substrate or a metal substrate and a silica film arranged on the substrate and formed using a silica film formation composition, in which the thickness of the silica film is 30 nm to 120 nm, the silica film formation composition comprises at least one compound A selected from the group consisting of a hydrolysable compound, a hydrolysis product thereof and a hydrolysis condensation product thereof and silica particles, and the hydrolysable compound comprises methyltrialkoxysilane and dimethyldialkoxysilane.
Inventors:
HAGIWARA MINAMI (JP)
Application Number:
PCT/JP2021/027986
Publication Date:
March 24, 2022
Filing Date:
July 28, 2021
Export Citation:
Assignee:
AGC INC (JP)
International Classes:
B32B17/04; B32B15/04; C03C17/25; C03C23/00; C09D7/61; C09D201/10
Domestic Patent References:
| WO2009022583A1 | 2009-02-19 |
Foreign References:
| JP2009053373A | 2009-03-12 | |||
| JP2000081214A | 2000-03-21 |
Attorney, Agent or Firm:
EIKOH PATENT FIRM, P.C. (JP)
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