SUBSTRATE

WIPO Patent Application WO/2019/087436

A1

A substrate (1) comprises an insulating substrate layer (20), and metal wires (33) that are disposed on the substrate layer (20) and that extend in a first direction. The substrate layer (20) has, below the metal wires (33), a groove (53) that is recessed from the upper surface and that extends in a second direction orthogonal to the first direction. Accordingly, when the substrate 1 is bent at a point near the groove (53) toward a direction so as to be upwardly projected, the gap, in the first direction, between the base ends of the metal wires (33) can be made larger, compared to a case where no groove is included. Consequently, while the amount of deformation of the substrate (1) is suppressed, the distance between the base ends of the metal wires (33) can be made large. Therefore, when the metal wires (33) are electrodes with a broken portion, the distance between the electrodes is easily adjusted. In addition, in a case where the metal wires (33) are connected, the electrodes can be easily obtained by increasing the distance between the base ends, and then, breaking the metal wires. Accordingly, a substrate having electrodes which have fine tip portions and between which the distances are easily adjusted, and a substrate having metal wires that are materials of the electrodes, can be provided.

TANIGUCHI MASATERU (JP)
OHSHIRO TAKAHITO (JP)
SANADA MASAKAZU (JP)
MIYAGI TADASHI (JP)

PCT/JP2018/017001

May 09, 2019

April 26, 2018

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SCREEN HOLDINGS CO LTD (JP)
UNIV OSAKA (JP)

G01N27/06

WO2017102852A1

2017-06-22

JP2017509899A	2017-04-06
JP2013215725A	2013-10-24
US20140124372A1	2014-05-08

NISHIDA Takami (JP)

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