Title:
SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2020/095786
Kind Code:
A1
Abstract:
This substrate is provided with: a dielectric layer that transmits visible light and that has a first surface and a second surface on the opposite side from the first surface; a mesh-like antenna conductor provided on the first surface side; and a mesh-like ground conductor provided on the second surface side. For example, mesh-like signal wiring is provided on the dielectric layer, and the signal wiring supplies electrical power to the antenna conductor. Also provided is a substrate having a transmission line formed thereon, said substrate being provided with a dielectric layer that transmits visible light and a mesh-like ground conductor provided on the dielectric layer. The transmission line has a structure that includes the dielectric layer and the ground conductor.
Inventors:
IKUMA YOSHIYUKI (JP)
Application Number:
PCT/JP2019/042538
Publication Date:
May 14, 2020
Filing Date:
October 30, 2019
Export Citation:
Assignee:
AGC INC (JP)
AGC GLASS EUROPE (BE)
AGC FLAT GLASS NA INC (US)
AGC VIDROS DO BRASIL LTDA (BR)
AGC GLASS EUROPE (BE)
AGC FLAT GLASS NA INC (US)
AGC VIDROS DO BRASIL LTDA (BR)
International Classes:
H01Q1/38; H01Q13/08
Foreign References:
| US20030142018A1 | 2003-07-31 | |||
| JP2006303846A | 2006-11-02 | |||
| JP2012249204A | 2012-12-13 | |||
| JP2002511691A | 2002-04-16 | |||
| US20140332256A1 | 2014-11-13 | |||
| US6809045B1 | 2004-10-26 | |||
| JP2010147860A | 2010-07-01 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
Download PDF:
Previous Patent: MAGNETORESISTIVE ELEMENT AND SEMICONDUCTOR DEVICE
Next Patent: FILM FORMING METHOD AND SEMICONDUCTOR PRODUCTION APPARATUS
Next Patent: FILM FORMING METHOD AND SEMICONDUCTOR PRODUCTION APPARATUS