Title:
SUCTION STAGE AND METHOD FOR HOLDING WORKPIECE
Document Type and Number:
WIPO Patent Application WO/2023/139634
Kind Code:
A1
Abstract:
A suction stage (10) comprises: a stage body (11) on which a workpiece (100) is placed; a plurality of suction holes (14) extending downward from a surface of the stage body (11) and communicating with a suction pump (20), the plurality of suction holes (14) each having a circular lateral cross-sectional shape; and at least one sealing ball (30) thrown from above into at least one suction hole (14), arbitrarily selected from the plurality of suction holes (14), to seal the suction hole (14).
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| JPH0866872 | METHOD FOR SUCKING PRINTED WIRING BOARD |
| WO/2020/052044 | JIG |
Inventors:
UTANO TETSUYA (JP)
MURAMATSU HIROKATSU (JP)
MURAMATSU HIROKATSU (JP)
Application Number:
PCT/JP2022/001563
Publication Date:
July 27, 2023
Filing Date:
January 18, 2022
Export Citation:
Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
B25B11/00; B23Q3/08
Foreign References:
| JPS63109934A | 1988-05-14 | |||
| KR20130046751A | 2013-05-08 | |||
| JPH09277134A | 1997-10-28 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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