Title:
WORKPIECE HOLDING SYSTEM AND WORKPIECE HOLDING DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/139633
Kind Code:
A1
Abstract:
A workpiece holding system (10) includes a suction stage (12) that has one or more suction holes (20) formed thereon for sucking a mounted object that is mounted on the top surface, and a workpiece holding device (16) mounted on the suction stage (12) to hold a workpiece (100), wherein the workpiece holding device (16) includes a base plate (30) mounted on the suction stage (12), a holding stage (32) on which the workpiece (100) is to be mounted and that is able to change the posture with respect to the base plate (30), a suction passage (38) in communication with the suction hole (20), and a rotation actuator (34) that is driven by an air pressure generated by an air sucked or supplied via the suction passage (38) and that is for changing the posture of the holding stage (32).
Inventors:
UTANO TETSUYA (JP)
MURAMATSU HIROKATSU (JP)
MURAMATSU HIROKATSU (JP)
Application Number:
PCT/JP2022/001560
Publication Date:
July 27, 2023
Filing Date:
January 18, 2022
Export Citation:
Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
B25B11/00
Foreign References:
JPH0564784U | 1993-08-27 | |||
JP2015205365A | 2015-11-19 | |||
JP2018067603A | 2018-04-26 | |||
JPH0566989U | 1993-09-03 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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