Title:
SUPERCONDUCTING COMPOUND QUANTUM COMPUTING CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2020/075150
Kind Code:
A1
Abstract:
This superconducting compound quantum computing circuit comprises: a circuit board in which a wiring pattern of circuit elements, which includes quantum bits and observation electrodes for observing the states of the quantum bits, and a ground pattern, which is a ground potential, are formed on a circuit board surface, said circuit board being provided with through-electrodes that connect, within the circuit board, a ground pattern formed on a first surface among the surfaces of the circuit board and a ground pattern formed on a second surface, which is the rear surface of the first surface; first ground electrodes provided with first contact portions that are in contact with the ground pattern formed on the first surface of the circuit board, and first non-contact portions having a shape corresponding to the shape of the wiring pattern formed on the first surface; second ground electrodes provided with second contact portions that are in contact with the ground pattern formed on the second surface of the circuit board; control signal wiring that provides contact spring pins at the tip, said pins being in contact at position corresponding to the quantum bits so as to press the first surface of the circuit board against the first ground electrodes, or press the second surface of the circuit board against the second ground electrodes; and biasing members that press the first ground electrodes against the first surface of the circuit board, or press the second ground electrodes against the second surface of the circuit board. The first ground electrodes are in contact with the ground pattern via first extension portions that are formed by superconductor bodies having higher extensibility than the extensibility of the ground pattern. The second ground electrodes are in contact with the ground pattern via second extension portions that are formed by superconductor bodies having higher extensibility than the extensibility of the ground pattern.
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Inventors:
NAKAMURA YASUNOBU (JP)
TABUCHI YUTAKA (JP)
TAMATE SHUHEI (JP)
TABUCHI YUTAKA (JP)
TAMATE SHUHEI (JP)
Application Number:
PCT/IB2019/059335
Publication Date:
April 16, 2020
Filing Date:
October 31, 2019
Export Citation:
Assignee:
JAPAN SCIENCE & TECH AGENCY (JP)
International Classes:
H01L39/02; H01L39/22
Domestic Patent References:
| WO2018052414A1 | 2018-03-22 |
Foreign References:
| JP2016511534A | 2016-04-14 | |||
| JP2018011266A | 2018-01-18 | |||
| US7613765B1 | 2009-11-03 | |||
| JP2018191287A | 2018-11-29 | |||
| US7613765B1 | 2009-11-03 | |||
| US20160380636A1 | 2016-12-29 |
Other References:
See also references of EP 3866213A4
Attorney, Agent or Firm:
MATSUNUMA, Yasushi et al. (JP)
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