Title:
SUPERCONDUCTING WIRE CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/112391
Kind Code:
A1
Abstract:
This superconducting wire connection structure comprises a first superconducting wire and a second superconducting wire. The first superconducting wire has a first end section in the longitudinal direction of the first superconducting wire. The second superconducting wire has a second end section in the longitudinal direction of the second superconducting wire. The first superconducting wire and the second superconducting wire each have a substrate, a middle layer disposed on the substrate, and a superconducting layer disposed on the middle layer. A connection part, which is a section of the superconducting wire connection structure where the superconducting layer located at the first end section and the superconducting layer located at the second end section are connected, has a first sandwiching member and a second sandwiching member. The superconducting layer at the first end section and the superconducting layer at the second end section are sandwiched by the first sandwiching member and the second sandwiching member. The thermal expansion rate of the first sandwiching member and the thermal expansion rate of the second sandwiching member are 0.95-1.05 times the thermal expansion rate of the substrate.
Inventors:
OHKI KOTARO (JP)
Application Number:
PCT/JP2022/031395
Publication Date:
June 22, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01B12/06; H01R4/68
Foreign References:
| JP2018170173A | 2018-11-01 | |||
| JP2014167887A | 2014-09-11 | |||
| JP2013235699A | 2013-11-21 | |||
| JPH02276180A | 1990-11-13 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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