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Title:
SURFACE LIGHT EMITTING ELEMENT, LIGHT EMITTING DEVICE, AND METHOD FOR MANUFACTURING SURFACE LIGHT EMITTING ELEMENT
Document Type and Number:
WIPO Patent Application WO/2023/037604
Kind Code:
A1
Abstract:
This surface light emitting element comprises: a substrate that has a first surface and a second surface opposed to the first surface; an epitaxial growth layer that has a first semiconductor layer of a first conductivity type, an active layer and a second semiconductor layer of a second conductivity type all of which are sequentially laminated on the second surface by epitaxial growth and that is distributed in the thickness direction and in the resonator length direction; an electrode that is electrically connected to the first semiconductor layer; a current injection region that is formed on the surface of the second semiconductor layer opposite to the substrate and that is electrically connected to the second semiconductor layer and further has an optical transparency; a first reflection layer that is formed on the first surface in accordance with the position of a predetermined thickness of the epitaxial growth layer and that has a curved mirror structure; and a second reflection layer that is formed on the surface of the current injection region opposite to the second semiconductor layer.

Inventors:
SATOU TATSUROU (JP)
KAWANISHI HIDEKAZU (JP)
KODA RINTARO (JP)
HAMAGUCHI TATSUSHI (JP)
NAKAYAMA EIJI (JP)
HOSHINA YUKIO (JP)
HAYASHI KENTARO (JP)
KEARNS JARED (JP)
Application Number:
PCT/JP2022/010414
Publication Date:
March 16, 2023
Filing Date:
March 09, 2022
Export Citation:
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Assignee:
SONY GROUP CORP (JP)
International Classes:
H01S5/183
Domestic Patent References:
WO2019171864A12019-09-12
Foreign References:
JP2018073931A2018-05-10
JPH0537017A1993-02-12
US20180287345A12018-10-04
Attorney, Agent or Firm:
TSUBASA PATENT PROFESSIONAL CORPORATION (JP)
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