Title:
SURFACE MOUNT TYPE LC DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/057423
Kind Code:
A1
Abstract:
This surface mount type LC device has: a substrate (10) having a first surface (S1); a plurality of inductors formed on the first surface (S1) of the substrate (10) and each configured by coil-shaped conductor patterns (70A, 70B, 70C, 70D); a first insulating layer (21) for covering the plurality of coil-shaped conductor patterns (70A, 70B, 70C, 70D); and a capacitor formed on top of the first insulating layer (21) and configured by planar electrodes. The planar electrodes cover first regions which are adjacent to each other and for which the current directions have a reverse relationship among the plurality of coil-shaped conductor patterns (70A, 70B, 70C, 70D) as seen in a plan view of the substrate (10).
Inventors:
ISHIZUKA KENICHI (JP)
YAZAKI HIROKAZU (JP)
YAZAKI HIROKAZU (JP)
Application Number:
PCT/JP2016/078553
Publication Date:
April 06, 2017
Filing Date:
September 28, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01F27/00; H01F17/00; H01G4/40; H01L21/822; H01L27/04; H03H7/01
Domestic Patent References:
| WO2004065669A1 | 2004-08-05 | |||
| WO2013164929A1 | 2013-11-07 |
Foreign References:
| JP2010268130A | 2010-11-25 | |||
| JP2004079973A | 2004-03-11 | |||
| JP2005268935A | 2005-09-29 | |||
| JP2004311734A | 2004-11-04 | |||
| JP2005167468A | 2005-06-23 | |||
| JP2009147921A | 2009-07-02 | |||
| JPH0613109U | 1994-02-18 | |||
| JP2013128022A | 2013-06-27 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
Download PDF:
Previous Patent: THIN FILM LC COMPONENT AND MOUNTING STRUCTURE OF SAME
Next Patent: MOLDED RESIN STRAND
Next Patent: MOLDED RESIN STRAND