SURFACE PROTECTIVE FILM

WIPO Patent Application WO/2013/094760

A1

A surface protective film having an adhesive layer comprising: [1] acting as the main component of the adhesive agent, a combination of (a) the hydrogenated product (I) of a copolymer (I') represented by the equation [A-B]n (where n is 1-3), and (b) the hydrogenated product (II) of a copolymer (II') having A in at least two terminals, and having at least one B in the middle portion; and [2] acting as a tackifier, a phenolic resin having a phenol content of 5-45%. The mass ratio of A and B contained in (I') and (II') is 5:9 - 25:75. The unit content of aromatic alkenyl compounds in (I') and (II') is 5-50 mass%. The hydrogenation rate of (I) and (II) is at least 80%. A is a polymer block comprising at least 80 mass% of aromatic alkenyl compound units. B is a polymer block which comprises at least 50 mass% of conjugated diene compound units, and in which the content of the vinyl bonds derived from the conjugated diene compound is at least 50 mol%.

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FUKUMOTO YUICHIRO (JP)
TOYOSHIMA KATSUNORI (JP)

PCT/JP2012/083363

June 27, 2013

December 21, 2012

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SEKISUI CHEMICAL CO LTD (JP)

G02B5/02; B32B25/16; B32B27/00; C09J7/22; C09J7/38; C09J11/06; C09J153/00

WO2007126081A1	2007-11-08
WO2010029773A1	2010-03-18
WO2011122287A1	2011-10-06

JP2010214853A	2010-09-30
JP2010018796A	2010-01-28
JPH0292982A	1990-04-03

SAEGUSA & PARTNERS (JP)
Patent business corporation 3 Edakuni [Hajime] patent firm (JP)

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