Title:
SURFACE-TREATED COPPER FOIL, COPPER-CLADDED LAMINATE PLATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/117338
Kind Code:
A1
Abstract:
This surface-treated copper foil comprises: a copper foil; and a surface-treatment layer formed on at least one surface of the copper foil. In the surface-treated copper foil, the load area ratio SMr1 that divides a protruding peak portion from a core portion of the surface-treatment layer is 16-28%.
Inventors:
GOTO IKUHIRO (JP)
Application Number:
PCT/JP2020/038988
Publication Date:
June 17, 2021
Filing Date:
October 15, 2020
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D7/06; C25D5/10; C25D5/12; C25D5/16; H05K1/09; H05K3/38
Foreign References:
| JP2019178416A | 2019-10-17 | |||
| JP2018090903A | 2018-06-14 | |||
| JP2017036495A | 2017-02-16 | |||
| JP2014152352A | 2014-08-25 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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