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Title:
SURFACE-TREATED COPPER FOIL AND LAMINATE USING SAME
Document Type and Number:
WIPO Patent Application WO/2014/073696
Kind Code:
A1
Abstract:
Provided are a surface-treated copper foil exhibiting excellent resin transparency after removal of the copper foil by etching, and a laminate using the same. A surface-treated copper foil, wherein when adhering the copper foil to both surfaces of a polyimide resin substrate from the treated-surface side, then removing the same from both surfaces by etching, and capturing an image of printed matter on which a linear mark is printed, given that the difference between the top average value (Bt) and the bottom average value (Bb) of a brightness curve produced from the end of the mark to a section on which the mark is not drawn is ΔB (ΔB=Bt-Bb) in the obtained observation point/brightness graph, and when the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and Bt is t1 in the observation point/brightness graph, and the value expressing the position of the intersection nearest the linear mark among the intersections between the brightness curve and 0.1ΔB is t2, in a range up to a depth of 0.1ΔB with Bt from the intersection between the brightness curve and Bt as a reference, then Sv defined in this formula (1) is 3.5 or higher. Sv=(ΔB×0.1)/(t1-t2) (1)

Inventors:
ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)
Application Number:
PCT/JP2013/080481
Publication Date:
May 15, 2014
Filing Date:
November 11, 2013
Export Citation:
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Assignee:
JX NIPPON MINING & METALS CORP (JP)
International Classes:
C25D1/04; B21B1/40; B21B3/00; B32B15/088; C25D7/06; H05K1/09; H05K3/00; H05K3/38
Foreign References:
JP2012212529A2012-11-01
JP2012211351A2012-11-01
JP2011240625A2011-12-01
JP2012224941A2012-11-15
JPH0987889A1997-03-31
Attorney, Agent or Firm:
AXIS Patent International (JP)
Axis international patent business corporation (JP)
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