SURFACE-TREATED COPPER FOIL AND LAMINATED BOARD USING SAME

WIPO Patent Application WO/2014/038716

A1

Provided are surface-treated copper foil and a laminated board using this surface-treated copper foil which yields superior resin transparency after the copper foil has been etched and removed. After surface-treated copper foil has been applied to both surfaces of a polyimide resin substrate on the surface-treated side, the copper foil on both surfaces is etched and removed, and a print on which a linear mark has been printed is photographed. In the resulting observation point/brightness graph, the difference between the top average value Bt and the bottom average value Bb of the brightness curve produced in the portion at the end of the mark in which the mark has not been rendered is ΔB (ΔB = Bt-Bb). Sv defined by Equation (1) below is equal to or greater than 3.5, where t1 is the value indicating the position of the intersection point closest to the linear mark among the intersection points of the brightness curve with Bt, and t2 is the value indicating the intersection point closest to the linear mark among the intersection points of the brightness curve to 0.1 ΔB in the depth range from the intersection points between the brightness curve and Bt to 0.1 ΔB with reference to Bt in the observation point/brightness graph. Sv = (ΔB × 0.1)/(t1 - t2) (1)

ARAI HIDETA (JP)
MIKI ATSUSHI (JP)
ARAI KOHSUKE (JP)
NAKAMURO KAICHIRO (JP)

PCT/JP2013/074438

March 13, 2014

September 10, 2013

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JX NIPPON MINING & METALS CORP (JP)

C25D7/06; B21B1/40; B21B3/00; B32B15/08; C25D1/04; H05K1/09

WO2012133564A1	2012-10-04
WO2012133565A1	2012-10-04

JPH0987889A	1997-03-31
JP2011240625A	2011-12-01

AXIS Patent International (JP)
Axis international patent business corporation (JP)

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