SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD

WIPO Patent Application WO/2011/090174

A1

Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 μm or below. On the roughened surface, an Ni-Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 μm, a height of 0.6-1.8 μm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 μm. The aforesaid Ni-Zn alloy layer has a Zn content of 6-30 wt% and a Zn deposition rate of 0.08 mg/dm2 or more.

FUJISAWA SATOSHI (JP)
UNO TAKEO (JP)
HATTORI KOICHI (JP)

PCT/JP2011/051131

July 28, 2011

January 21, 2011

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FURUKAWA ELECTRIC CO LTD (JP)
NIPPON STEEL CHEMICAL CO (JP)
FUJISAWA SATOSHI (JP)
UNO TAKEO (JP)
HATTORI KOICHI (JP)

C25D7/06; B32B15/01; B32B15/08; C25D5/10; H05K1/09

JP2006103189A	2006-04-20
JP2007238968A	2007-09-20
JP2007332418A	2007-12-27
JP2006142514A	2006-06-08
JP2008285751A	2008-11-27
JP2000269637A	2000-09-29
JPH11256389A	1999-09-21
JP2005344174A	2005-12-15

SATOH, TAKAHISA (JP)
Takahisa Sato (JP)

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