Title:
SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS
Document Type and Number:
WIPO Patent Application WO/2019/095127
Kind Code:
A1
Abstract:
A system for controlling damages in cleaning a semiconductor wafer (1010) comprising features of patterned structures, comprising: a wafer chuck (1014) for temporary restraining a semiconductor wafer (1010) during a cleaning process; a nozzle (1012) for delivering a cleaning liquid over a surface of the semiconductor wafer (1010); a sonic generator (25082) configured to alternately operate at a first frequency (f 1) and a first power level (P 1) for a first predetermined period of time (τ 1) and at a second frequency (f2) and a second power level (P2) for a second predetermined period of time (τ 2), to impart sonic energy to the cleaning liquid, wherein the first predetermined period of time (τ 1) and the second predetermined period of time (τ 2) consecutively follows one another; and a controller programmed to provide the cleaning parameters, wherein at least one of the cleaning parameters is determined such that a percentage of damaged features as a result of the imparting sonic energy is lower than a predetermined threshold.
Inventors:
WANG HUI (CN)
CHEN FUFA (CN)
CHEN FUPING (CN)
WANG JIAN (CN)
WANG XI (CN)
ZHANG XIAOYAN (CN)
JIN YINUO (CN)
JIA ZHAOWEI (CN)
XIE LIANGZHI (CN)
WANG JUN (CN)
LI XUEJUN (CN)
CHEN FUFA (CN)
CHEN FUPING (CN)
WANG JIAN (CN)
WANG XI (CN)
ZHANG XIAOYAN (CN)
JIN YINUO (CN)
JIA ZHAOWEI (CN)
XIE LIANGZHI (CN)
WANG JUN (CN)
LI XUEJUN (CN)
Application Number:
PCT/CN2017/111016
Publication Date:
May 23, 2019
Filing Date:
November 15, 2017
Export Citation:
Assignee:
ACM RES SHANGHAI INC (CN)
International Classes:
H01L21/02
Domestic Patent References:
| WO2016183811A1 | 2016-11-24 |
Foreign References:
| CN101879511A | 2010-11-10 | |||
| CN102430543A | 2012-05-02 | |||
| CN101345189A | 2009-01-14 | |||
| US5931173A | 1999-08-03 |
Attorney, Agent or Firm:
SHANGHAI PATENT & TRADEMARK LAW OFFICE, LLC (CN)
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