Title:
SYSTEMS AND METHODS FOR MECHANICAL AND/OR CHEMICAL-MECHANICAL POLISHING OF MICROFEATURE WORKPIECES
Document Type and Number:
WIPO Patent Application WO2004098829
Kind Code:
A3
Abstract:
Systems (100) and methods for polishing microfeature workpieces (112). In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece (112) and moving a carrier head (130) and/or a polishing pad (140) relative to the other to rub the microfeature workpiece (112) against the polishing pad (140) after determining the status of the characteristic of the microfeature workpiece. The carrier head also carries a plurality of piezoelectric members (150). The method further includes applying pressure against a back side of the microfeature workpiece (112) in response to the determined status of the characteristic by energizing at least one of the plurality of piezoelectric members (150). In another embodiment, a system includes a workpiece carrier assembly, a plurality of piezoelectric members (150), a polishing pad, a metrology tool for determining a status of the characteristic, and a controller. The controller can have a computer-readable medium containing instructions to perform the above-mentioned method.
More Like This:
| JP2004160629 | WAFER POLISHING DEVICE |
| WO/2004/002676 | PARTIAL-MEMBRANE CARRIER HEAD |
Inventors:
ELLEDGE JASON B (US)
Application Number:
PCT/US2004/012765
Publication Date:
December 23, 2004
Filing Date:
April 26, 2004
Export Citation:
Assignee:
MICRON TECHNOLOGY INC (US)
ELLEDGE JASON B (US)
ELLEDGE JASON B (US)
International Classes:
B24B37/30; B24B49/16; (IPC1-7): B24B37/04; B24B41/06; B24B49/16
Domestic Patent References:
| WO2004067228A1 | 2004-08-12 |
Foreign References:
| US6325696B1 | 2001-12-04 | |||
| US20020052052A1 | 2002-05-02 | |||
| US5720845A | 1998-02-24 |
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