SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CLAMPING SYSTEMS

Title:

SYSTEMS AND METHODS OF OPERATING WIRE BONDING MACHINES INCLUDING CLAMPING SYSTEMS

Document Type and Number:

WIPO Patent Application WO/2019/139954

Kind Code:

A1

Abstract:

A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

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Inventors:

KLAEMER PETER (US)
FU JASON (US)
LUECHINGER CHRISTOPH (US)

Application Number:

PCT/US2019/012854

Publication Date:

July 18, 2019

Filing Date:

January 09, 2019

Export Citation:

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Assignee:

KULICKE & SOFFA IND INC (US)

International Classes:

H01L23/00

Foreign References:

US20130228611A1	2013-09-05
US20040139782A1	2004-07-22
KR20010058948A	2001-07-06
JP2001223238A	2001-08-17
JP6240866B2	2017-12-06

Attorney, Agent or Firm:

SPLETZER, Christopher, M., Sr. (US)

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