Title:
TEMPERATURE SENSOR AND DEVICE PROVIDED WITH TEMPERATURE SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/003497
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a temperature sensor able not only to prevent failures where a temperature-sensitive sintered body ends up coming out of a protective case together with a packing resin, but also to curb changes in properties of the temperature-sensitive sintered body and ensure reliability; and a device provided with this temperature sensor. A temperature sensor (1) is provided with: a protective case (2) that has a linear expansion coefficient of 7.5 to 19.5 × 10-6/°C; a temperature-sensitive sintered body (3) that is arranged inside the protective case (2); a lead wire (4) that is connected to the temperature-sensitive sintered body (3) and has a cross-sectional area of 0.097 mm2 or less; and a packing resin (6) that has a linear expansion coefficient of 7.5 to 19.5 × 10-6/°C and that is packed around the temperature-sensitive sintered body (3) inside the protective case (2).
Inventors:
BABA TAKEHIRO (JP)
Application Number:
PCT/JP2017/021930
Publication Date:
January 04, 2018
Filing Date:
June 14, 2017
Export Citation:
Assignee:
SEMITEC CORP (JP)
International Classes:
G01K7/22; G01K1/08; H01C1/028
Foreign References:
| JPH0575629U | 1993-10-15 | |||
| JP2012211792A | 2012-11-01 | |||
| JPH0854291A | 1996-02-27 | |||
| JP2005024344A | 2005-01-27 |
Attorney, Agent or Firm:
IZUMI Junichi (JP)
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