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Title:
TEMPERED GLASS PLATE
Document Type and Number:
WIPO Patent Application WO/2012/118029
Kind Code:
A1
Abstract:
The present invention provides a tempered glass plate having a low thermal expansion coefficient, high surface compressive stress by physical strengthening, low density, and excellent abrasion resistance. The tempered glass plate has the following composition, in mass percent, and can be strengthened by heating and quenching, the composition consisting of 55-85% of SiO2, 2-12% of B2O3, 0.1-12% of MgO, 0.1-12% of CaO, 0-13% of Na2O, 3-16% of MgO+CaO+SrO+ZnO, and 0-3% of Al2O3.

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Inventors:
KOIKE AKIO (JP)
ITO SETSURO (JP)
Application Number:
PCT/JP2012/054821
Publication Date:
September 07, 2012
Filing Date:
February 27, 2012
Export Citation:
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Assignee:
ASAHI GLASS CO LTD (JP)
KOIKE AKIO (JP)
ITO SETSURO (JP)
International Classes:
C03C3/089; C03B27/00; C03C3/091; C03C3/093
Foreign References:
JP2003119048A2003-04-23
JPH0769669A1995-03-14
JPH02221137A1990-09-04
JP2006175877A2006-07-06
JPH09124338A1997-05-13
Other References:
See also references of EP 2682374A4
Attorney, Agent or Firm:
SENMYO, Kenji et al. (JP)
Spring name Kenji (JP)
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Claims:



 
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