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Title:
TEMPORARY PROTECTIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2023/042839
Kind Code:
A1
Abstract:
The present invention provides a temporary protective material which has water resistance and which can protect a component mounting surface, in a semiconductor substrate mounting step. This temporary protective material is used as a protective material during semiconductor production, and contains a polyvinyl alcohol resin and a crosslinking agent.

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Inventors:
YONEDA YOSHIKAZU (JP)
YAMADA TASUKU (JP)
Application Number:
PCT/JP2022/034337
Publication Date:
March 23, 2023
Filing Date:
September 14, 2022
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01L21/02; C09J7/38; C09J7/40; C09J11/04; C09J11/06; C09J129/04; H01L21/301; H01L21/304
Domestic Patent References:
WO2010047253A12010-04-29
Foreign References:
JP2016139690A2016-08-04
JP2020528165A2020-09-17
JP2017098298A2017-06-01
JP2016066768A2016-04-28
JPH07224270A1995-08-22
Attorney, Agent or Firm:
WISEPLUS IP FIRM (JP)
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